Effect of EFO parameters on the HAZ and bondability of gold wire
Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) |
| Editors | Tianchun YE, Fei XIAO, Jun WANG, Lin CHEN |
| Publisher | IEEE |
| Pages | 413-418 |
| ISBN (Electronic) | 9781538663868 |
| Publication status | Published - Aug 2018 |
Publication series
| Name | International Conference on Electronic Packaging Technology (ICEPT) |
|---|---|
| Publisher | IEEE |
Conference
| Title | 19th International Conference on Electronic Packaging Technology, ICEPT 2018 |
|---|---|
| Place | China |
| City | Shanghai |
| Period | 8 - 11 August 2018 |
Link(s)
Abstract
The effect of electrical flame off (EFO) discharge parameters on the heat affected zone (HAZ) and bondability of gold wire was studied in this paper. The wire was fired and then bonded in a ball bonding procedure, in which the effect of EFO supplying current and firing time was analyzed. The results show that the diameter of free air ball (FAB) increases as the EFO time or current increases on the basis of a same current or time. With the increase of EFO current on the basis of a comparable FAB size, both the length and the grain size of HAZ decrease. The wire exhibits increasing tensile breaking load and elongation in the HAZ, and wire pulling force after bonding with the increase of current. The FAB under higher current presents better deformability and smaller bonded ball height. However, decreasing of ball shear force indicates the decrease of bondability with the increase of current.
Research Area(s)
- Bondability, Free air ball, Gold wire, Heat affected zone, Wire bonding
Citation Format(s)
Effect of EFO parameters on the HAZ and bondability of gold wire. / Zhou, Wenyan; Wu, Yongjin; Chen, Jialin et al.
Proceedings: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). ed. / Tianchun YE; Fei XIAO; Jun WANG; Lin CHEN. IEEE, 2018. p. 413-418 8480579 (International Conference on Electronic Packaging Technology (ICEPT)).
Proceedings: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). ed. / Tianchun YE; Fei XIAO; Jun WANG; Lin CHEN. IEEE, 2018. p. 413-418 8480579 (International Conference on Electronic Packaging Technology (ICEPT)).
Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
