Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Lingyun Zhang; Shengquan Ou; Joanne Huang; K. N. Tu; Stephen Gee; Luu Nguyen

doi:10.1063/1.2158702

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Lingyun Zhang^*
, Shengquan Ou
, Joanne Huang
, K. N. Tu
, Stephen Gee
, Luu Nguyen

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

183 Citations (Scopus)

Abstract

We propose a kinetic model to describe a pancake-type void propagation in flip chip solder joints due to current crowding in electromigration. The divergence of the vacancy fluxes at the interface between the solder and Cu₆Sn₅ leads to void formation and propagation along the interface between them. Based on the continuity condition, the void growth velocity is calculated. The theoretical calculations are in reasonable agreement with the experimental results. © 2006 American Institute of Physics.

Original language	English
Article number	012106
Journal	Applied Physics Letters
Volume	88
Issue number	1
Online published	4 Jan 2006
DOIs	https://doi.org/10.1063/1.2158702
Publication status	Published - Jan 2006
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints",

abstract = "We propose a kinetic model to describe a pancake-type void propagation in flip chip solder joints due to current crowding in electromigration. The divergence of the vacancy fluxes at the interface between the solder and Cu6Sn5 leads to void formation and propagation along the interface between them. Based on the continuity condition, the void growth velocity is calculated. The theoretical calculations are in reasonable agreement with the experimental results. {\textcopyright} 2006 American Institute of Physics.",

author = "Lingyun Zhang and Shengquan Ou and Joanne Huang and Tu, \{K. N.\} and Stephen Gee and Luu Nguyen",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

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T1 - Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

AU - Zhang, Lingyun

AU - Ou, Shengquan

AU - Huang, Joanne

AU - Tu, K. N.

AU - Gee, Stephen

AU - Nguyen, Luu

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2006/1

Y1 - 2006/1

N2 - We propose a kinetic model to describe a pancake-type void propagation in flip chip solder joints due to current crowding in electromigration. The divergence of the vacancy fluxes at the interface between the solder and Cu6Sn5 leads to void formation and propagation along the interface between them. Based on the continuity condition, the void growth velocity is calculated. The theoretical calculations are in reasonable agreement with the experimental results. © 2006 American Institute of Physics.

AB - We propose a kinetic model to describe a pancake-type void propagation in flip chip solder joints due to current crowding in electromigration. The divergence of the vacancy fluxes at the interface between the solder and Cu6Sn5 leads to void formation and propagation along the interface between them. Based on the continuity condition, the void growth velocity is calculated. The theoretical calculations are in reasonable agreement with the experimental results. © 2006 American Institute of Physics.

UR - https://www.scopus.com/pages/publications/33645517630

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-33645517630&origin=recordpage

U2 - 10.1063/1.2158702

DO - 10.1063/1.2158702

M3 - RGC 21 - Publication in refereed journal

SN - 0003-6951

VL - 88

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 1

M1 - 012106

ER -

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Abstract

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