Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Surface Diffusion Material Science
100
Coating Material Science
100
Void Growth Material Science
100
Surface (Surface Sc... Material Science
50
Cathode Material Science
50
Grain Boundaries Material Science

Keyphrases

100
Cu3Sn Keyphrases
100
Electromigration Keyphrases
100
Lifetime Improvemen... Keyphrases
100
Damascene Interconn... Keyphrases
100
Dual Damascene Keyphrases
66
Void Growth Keyphrases
66
Kink Keyphrases
66
Surface Diffusion Keyphrases
33
Order of Magnitude Keyphrases
33
Dissociation Keyphrases
33
Overlayer Keyphrases
33
Adatoms Keyphrases
33
Grain Boundary Diff... Keyphrases
33
Terraces Keyphrases
33
Diffusion Path Keyphrases
33
Surface Steps Keyphrases
33
Ledge Keyphrases
33
Chemical Binding Keyphrases
33
Interfacial Boundar... Keyphrases
33
Cu Surface Keyphrases
33
Cu Interconnect Keyphrases
33
Interconnect Line Keyphrases
33
Kink Model Keyphrases

Chemistry

100
Surface Chemistry
100
Atom Chemistry
100
Surface Diffusion Chemistry
100
formation Chemistry
50
Grain Boundary Diff... Chemistry
50
Dissociation Chemistry
50
Cathode Chemistry
50
Adatoms Chemistry

INIS

100
surfaces INIS
100
coatings INIS
100
lifetime INIS
100
electromigration INIS
75
diffusion INIS
50
atoms INIS
50
voids INIS
25
dissociation INIS
25
layers INIS
25
failures INIS
25
grain boundaries INIS
25
cathodes INIS
25
supply INIS

Engineering

100
Surface Engineering
100
Interconnects Engineering
100
Electromigration Engineering
100
Dual Damascene Engineering
66
Void Growth Engineering
33
Failure (Mechanical... Engineering
33
Grain Boundary Diff... Engineering
33
Diffusion Path Engineering
33
Cu Surface Engineering
33
Model Engineering
Research OutputsResearch Output authored by Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects is tagged with the concept