Effect of cracks on thermal stress and strain of a tape automated bonded package

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

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Original languageEnglish
Pages (from-to)525-530
Journal / PublicationComposite Structures
Volume38
Issue number1-4
Publication statusPublished - May 1997

Abstract

A tape automated bonded (TAB) package is basically a composite structure. A three-dimensional finite element fracture analysis was performed to evaluate the effects of cracks in a TAB package under thermal cycling conditions. The lead-tin solder in the outer lead bond as well as the copper beam lead were taken as elasto-plastic materials. Interface cracks between the copper beam lead and the solder were included in the analysis. It was found that the prescribed cracks created new sources of stress concentrations, which are fairly mild. This result showed that the configuration of the outer lead bonds in TAB packages is generally resilient to thermal cycling, even with the presence of defects such as cracks. © 1997 Elsevier Science Ltd.