Effect of carbon inclusion in the Ni-P coating on shearing behavior of Sn4Ag0.5Cu ball grid array solder joints

X. Gu; Y. C. Chan; B. Y. Wu; D. Yang

doi:10.1109/ICEPT.2007.4441510

Effect of carbon inclusion in the Ni-P coating on shearing behavior of Sn4Ag0.5Cu ball grid array solder joints

X. Gu
, Y. C. Chan
, B. Y. Wu
, D. Yang

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It aimed at investigating the effect of carbon on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison. It was found that the carbon in the coating increased the brittleness of solder joints and weakened their shear strength. After shearing tests, more brittle fractures occurred in the intermetallic compound (IMC) layer in the Sn-4Ag-0.5Cu/Ni-P-CNTs (SAC/ Ni-P-CNTs) solder joints. After multiple reflows, a Ni₃Sn₄ IMC layer and a P-rich layer were formed in the solder joints on both coatings. The IMC layers in the SAC/Ni-P solder joints were found to be compact with chunky-shaped grains, whilst the IMC layers in the SAC/ Ni-P-CNTs solder joints were porous with needle-shaped grains. ©2007 IEEE.

Original language	English
Title of host publication	Proceedings of the Electronic Packaging Technology Conference, EPTC
DOIs	https://doi.org/10.1109/ICEPT.2007.4441510
Publication status	Published - 2007
Event	2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China Duration: 14 Aug 2007 → 17 Aug 2007

Conference

Conference	2007 8th International Conference on Electronic Packaging Technology, ICEPT
Place	China
City	Shanghai
Period	14/08/07 → 17/08/07

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10.1109/ICEPT.2007.4441510

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@inproceedings{e9298158afef44e8b8b698ab8bfcb530,

title = "Effect of carbon inclusion in the Ni-P coating on shearing behavior of Sn4Ag0.5Cu ball grid array solder joints",

abstract = "This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It aimed at investigating the effect of carbon on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison. It was found that the carbon in the coating increased the brittleness of solder joints and weakened their shear strength. After shearing tests, more brittle fractures occurred in the intermetallic compound (IMC) layer in the Sn-4Ag-0.5Cu/Ni-P-CNTs (SAC/ Ni-P-CNTs) solder joints. After multiple reflows, a Ni3Sn4 IMC layer and a P-rich layer were formed in the solder joints on both coatings. The IMC layers in the SAC/Ni-P solder joints were found to be compact with chunky-shaped grains, whilst the IMC layers in the SAC/ Ni-P-CNTs solder joints were porous with needle-shaped grains. {\textcopyright}2007 IEEE.",

author = "X. Gu and Chan, \{Y. C.\} and Wu, \{B. Y.\} and D. Yang",

year = "2007",

doi = "10.1109/ICEPT.2007.4441510",

language = "English",

isbn = "1424413923",

booktitle = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

note = "2007 8th International Conference on Electronic Packaging Technology, ICEPT ; Conference date: 14-08-2007 Through 17-08-2007",

}

Gu, X, Chan, YC, Wu, BY & Yang, D 2007, Effect of carbon inclusion in the Ni-P coating on shearing behavior of Sn4Ag0.5Cu ball grid array solder joints. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 4441510, 2007 8th International Conference on Electronic Packaging Technology, ICEPT, Shanghai, China, 14/08/07. https://doi.org/10.1109/ICEPT.2007.4441510

Effect of carbon inclusion in the Ni-P coating on shearing behavior of Sn4Ag0.5Cu ball grid array solder joints. / Gu, X.; Chan, Y. C.; Wu, B. Y. et al.
Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. 4441510.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Effect of carbon inclusion in the Ni-P coating on shearing behavior of Sn4Ag0.5Cu ball grid array solder joints

AU - Gu, X.

AU - Chan, Y. C.

AU - Wu, B. Y.

AU - Yang, D.

PY - 2007

Y1 - 2007

N2 - This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It aimed at investigating the effect of carbon on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison. It was found that the carbon in the coating increased the brittleness of solder joints and weakened their shear strength. After shearing tests, more brittle fractures occurred in the intermetallic compound (IMC) layer in the Sn-4Ag-0.5Cu/Ni-P-CNTs (SAC/ Ni-P-CNTs) solder joints. After multiple reflows, a Ni3Sn4 IMC layer and a P-rich layer were formed in the solder joints on both coatings. The IMC layers in the SAC/Ni-P solder joints were found to be compact with chunky-shaped grains, whilst the IMC layers in the SAC/ Ni-P-CNTs solder joints were porous with needle-shaped grains. ©2007 IEEE.

AB - This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It aimed at investigating the effect of carbon on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison. It was found that the carbon in the coating increased the brittleness of solder joints and weakened their shear strength. After shearing tests, more brittle fractures occurred in the intermetallic compound (IMC) layer in the Sn-4Ag-0.5Cu/Ni-P-CNTs (SAC/ Ni-P-CNTs) solder joints. After multiple reflows, a Ni3Sn4 IMC layer and a P-rich layer were formed in the solder joints on both coatings. The IMC layers in the SAC/Ni-P solder joints were found to be compact with chunky-shaped grains, whilst the IMC layers in the SAC/ Ni-P-CNTs solder joints were porous with needle-shaped grains. ©2007 IEEE.

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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-50249167614&origin=recordpage

U2 - 10.1109/ICEPT.2007.4441510

DO - 10.1109/ICEPT.2007.4441510

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 1424413923

SN - 9781424413928

BT - Proceedings of the Electronic Packaging Technology Conference, EPTC

T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT

Y2 - 14 August 2007 through 17 August 2007

ER -

Effect of carbon inclusion in the Ni-P coating on shearing behavior of Sn4Ag0.5Cu ball grid array solder joints

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