Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Detail(s)

Original languageEnglish
Pages (from-to)1028-1035
Journal / PublicationJournal of Electronic Materials
Volume33
Issue number9
Publication statusPublished - Sept 2004

Link(s)

Check@CityULib
Link to Scopus https://www.scopus.com/record/display.uri?eid=2-s2.0-4944234228&origin=recordpage
Permanent Link https://scholars.cityu.edu.hk/en/publications/publication(78f347a8-4d61-4d51-8257-cc245ad6310d).html

Abstract

The effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints was studied. It was observed that the factor of thermal warpage lead to a highly unreliable electrical connection in the assembly. The anisotropic conductive film (ACF) that was used is an epoxy resin in which nickel and gold-coated polymer balls are dispersed. The results showed that for the flip-chip-on-flex (FCOF) packages having an Au/Ni bump, the increase in online contact resistance is higher than that of the FCOF packages having bumpless chips.

Research Area(s)

  • Anisotropie conductive film (ACF), Coefficient of thermal expansion (CTE), Online contact resistance, Reliability, Thermal warpage

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Publication fingerprints text

100
Conductive Engineering
100
Anisotropic Engineering
100
Joints (Structural ... Engineering
100
Epoxy Resin Chemical Engineering
100
Film Chemical Engineering
100
Contact Resistance Keyphrases
100
Temperature Variati... Keyphrases
100
Bump Keyphrases
100
Online Contact Keyphrases
100
Characteristic Vari... Keyphrases
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Citation Format(s)

[ RIS ] [ BibTeX ]
Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints. / Ali, Lafir; Chan, Y. C.; Alam, M. O.
In: Journal of Electronic Materials, Vol. 33, No. 9, 09.2004, p. 1028-1035.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review