Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

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Original languageEnglish
Article number127891
Journal / PublicationMaterials Letters
Online published28 Apr 2020
Publication statusPublished - 1 Aug 2020


Wetting reactions of the medium entropy alloy of SnBiIn and SnBiInAg on Cu substrate have been investigated. The melting points of both SnBiIn and SnBiInAg are about 80 ºC. The reactions were performed at 120 ºC, 140 ºC, and 160 ºC. The kinetics of interfacial intermetallic compound (IMC) growth of Cu6Sn5 was studied to be ripening-controlled with activation energy about 11.1 kJ/mol for SnBiIn and 10.4 kJ/mol for SnBiInAg. However, the addition of Ag has effectively reduced the IMC growth by 20-30%. We propose that it is because Ag has reduced the pre-factor of diffusivity by increasing the entropy of the alloy. (C) 2020 Elsevier B.V. All rights reserved.

Research Area(s)

  • Electronic materials, Interface, Kinetics, Lead-free solder, Microstructure