Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

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Engineering & Materials Science

100
Soldering alloys Engineering & Materials S...
71
Intermetallics Engineering & Materials S...
29
Soldering Engineering & Materials S...
14
Substrates Engineering & Materials S...
7
Rate constants Engineering & Materials S...
Research OutputsResearch Output authored by Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging is tagged with the concept