Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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Detail(s)

Original languageEnglish
Pages (from-to)208-214
Journal / PublicationJournal of Alloys and Compounds
Volume407
Issue number1-2
Publication statusPublished - 5 Jan 2006

Abstract

Intermetallic compound (IMC) formations of Sn-2.8Ag-0.5Cu solder with additional 1 wt% Bi were studied for Cu-substrate during soldering at 255 °C and isothermal aging at 150 °C. It was found that addition of 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder inhibits the excessive formation of intermetallic compounds during the soldering reaction and thereafter in aging condition. Though the intermetallic compound layer was Cu6Sn5, after 14 days of aging a thin Cu3Sn layer was also observed for both solders. A significant increase of intermetallic layer thickness was observed for both solders where the increasing tendency was lower for Bi-containing solder. After various days of aging, Sn-2.8Ag-0.5Cu-1.0Bi solder gives comparatively planar intermetallic layer at the solder-substrate interface than that of the Sn-2.8Ag-0.5Cu solder. The formation of intermetallic compounds during aging for both solders follows the diffusion control mechanism and the diffusion of Cu is more pronounced for Sn-2.8Ag-0.5Cu solder. Intermetallic growth rate constants for Sn-2.8Ag-0.5Cu and Sn-2.8Ag-0.5Cu-1.0Bi solders were calculated as 2.21 × 10-17 and 1.91 × 10-17 m2/s, respectively, which had significant effect on the growth behavior of intermetallic compounds during aging.

Research Area(s)

  • Aging, Growth rate, Interfacial reactions, Intermetallic compounds, Soldering

Citation Format(s)

Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. / Rizvi, M. J.; Chan, Y. C.; Bailey, C.; Lu, H.; Islam, M. N.

In: Journal of Alloys and Compounds, Vol. 407, No. 1-2, 05.01.2006, p. 208-214.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal