Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Engineering & Materials Science

Research OutputsResearch Output authored by Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging is tagged with the concept