Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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Detail(s)

Original languageEnglish
Pages (from-to)122-128
Journal / PublicationJournal of Alloys and Compounds
Volume438
Issue number1-2
Publication statusPublished - 12 Jul 2007

Abstract

The growth behavior of intermetallic layer with or without adding 0.3 wt% Ni into the Sn-0.7Cu solder was studied during the wetting reaction on Cu-substrate and thereafter in solid-state aging condition. The Cu-solder reaction couple was prepared at 255, 275 and 295 °C for 10 s. The samples reacted at 255 °C were then isothermally aged for 2-14 days at 150 °C. The reaction species formed for the Sn-0.7Cu/Cu and Sn-0.7Cu-0.3Ni/Cu soldering systems were Cu6Sn5 and (CuNi)6Sn5, respectively. The thickness of the intermetallic compounds formed at the solder/Cu interfaces and also in the bulk of both solders increased with the increase of reaction temperature. It was found that Ni-containing Sn-0.7Cu solder exhibited lower growth of intermetallic layer during wetting and in the early stage of aging and eventually exceeded the intermetallic layer thickness of Sn-0.7Cu/Cu soldering system after 6 days of aging. As the aging time proceeds, a non-uniform intermetallic layer growth tendency was observed for the case of Sn-0.7Cu-0.3Ni solder. The growth behavior of intermetallic layer during aging for both solders followed the diffusion-controlled mechanism. The intermetallic layer growth rate constants for Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders were calculated as 1.41 × 10-17 and 1.89 × 10-17 m2/s, respectively which indicated that adding 0.3 wt% Ni with Sn-0.7Cu solder contributed to the higher growth of intermetallic layer during aging. © 2006 Elsevier B.V. All rights reserved.

Research Area(s)

  • Aging, Intermetallic compound layer, Solder, Wetting

Citation Format(s)

Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging. / Rizvi, M. J.; Bailey, C.; Chan, Y. C.; Islam, M. N.; Lu, H.

In: Journal of Alloys and Compounds, Vol. 438, No. 1-2, 12.07.2007, p. 122-128.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal