Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint

Hao Peng; Bomin Huang; Guang Chen; Fengshun Wu; Hui Liu; Y. C. Chan

doi:10.1109/ICEPT.2015.7236751

Effect of 0.8 wt% Al₂O₃ nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint

Hao Peng, Bomin Huang, Guang Chen, Fengshun Wu^*, Hui Liu, Y. C. Chan

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

4 Citations (Scopus)

Abstract

In this study, 0.8 wt% Al₂O₃ nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% Al₂O₃ nanoparticles addition, finer microstructure with smaller ß-Sn grains was obtained in the composite solder matrices in comparison to the unreinforced SAC solder. In addition, the electromigration analysis indicates the addition of Al₂O₃ nanoparticles could effectively suppress the dissolution of intermetallic compound (IMC) and the formation of voids at the cathode as well as the growth of IMC at the anode induced by electromigration.

Original language	English
Title of host publication	Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE
Pages	1014-1017
ISBN (Electronic)	978-1-4673-7999-1
DOIs	https://doi.org/10.1109/ICEPT.2015.7236751
Publication status	Published - Aug 2015
Event	16th International Conference on Electronic Packaging Technology, ICEPT 2015 - Changsha, China Duration: 11 Aug 2015 → 14 Aug 2015

Conference

Conference	16th International Conference on Electronic Packaging Technology, ICEPT 2015
Place	China
City	Changsha
Period	11/08/15 → 14/08/15

Research Keywords

Al2O3 nanoparticles
composite solder
electromigration
IMC

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10.1109/ICEPT.2015.7236751

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Peng, H., Huang, B., Chen, G., Wu, F., Liu, H., & Chan, Y. C. (2015). Effect of 0.8 wt% Al₂O₃ nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint. In Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (pp. 1014-1017). Article 7236751 IEEE. https://doi.org/10.1109/ICEPT.2015.7236751

@inproceedings{c044b4d6bd894410b236535f0b693dea,

title = "Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint",

abstract = "In this study, 0.8 wt% Al2O3 nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% Al2O3 nanoparticles addition, finer microstructure with smaller {\ss}-Sn grains was obtained in the composite solder matrices in comparison to the unreinforced SAC solder. In addition, the electromigration analysis indicates the addition of Al2O3 nanoparticles could effectively suppress the dissolution of intermetallic compound (IMC) and the formation of voids at the cathode as well as the growth of IMC at the anode induced by electromigration.",

keywords = "Al2O3 nanoparticles, composite solder, electromigration, IMC",

author = "Hao Peng and Bomin Huang and Guang Chen and Fengshun Wu and Hui Liu and Chan, {Y. C.}",

year = "2015",

month = aug,

doi = "10.1109/ICEPT.2015.7236751",

language = "English",

pages = "1014--1017",

booktitle = "Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT)",

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note = "16th International Conference on Electronic Packaging Technology, ICEPT 2015 ; Conference date: 11-08-2015 Through 14-08-2015",

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Peng, H, Huang, B, Chen, G, Wu, F, Liu, H & Chan, YC 2015, Effect of 0.8 wt% Al₂O₃ nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint. in Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT) ., 7236751, IEEE, pp. 1014-1017, 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11/08/15. https://doi.org/10.1109/ICEPT.2015.7236751

Effect of 0.8 wt% Al₂O₃ nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint. / Peng, Hao; Huang, Bomin; Chen, Guang et al.
Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT) . IEEE, 2015. p. 1014-1017 7236751.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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AU - Peng, Hao

AU - Huang, Bomin

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AU - Liu, Hui

AU - Chan, Y. C.

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N2 - In this study, 0.8 wt% Al2O3 nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% Al2O3 nanoparticles addition, finer microstructure with smaller ß-Sn grains was obtained in the composite solder matrices in comparison to the unreinforced SAC solder. In addition, the electromigration analysis indicates the addition of Al2O3 nanoparticles could effectively suppress the dissolution of intermetallic compound (IMC) and the formation of voids at the cathode as well as the growth of IMC at the anode induced by electromigration.

AB - In this study, 0.8 wt% Al2O3 nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% Al2O3 nanoparticles addition, finer microstructure with smaller ß-Sn grains was obtained in the composite solder matrices in comparison to the unreinforced SAC solder. In addition, the electromigration analysis indicates the addition of Al2O3 nanoparticles could effectively suppress the dissolution of intermetallic compound (IMC) and the formation of voids at the cathode as well as the growth of IMC at the anode induced by electromigration.

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