Dynamic mixing deposition of niobium nitride films by cathodic arc plasma in ambient nitrogen

T. Zhang; J. H. Song; X. B. Tian; P. K. Chu; I. G. Brown

doi:10.1116/1.1372896

Dynamic mixing deposition of niobium nitride films by cathodic arc plasma in ambient nitrogen

T. Zhang
, J. H. Song
, X. B. Tian
, P. K. Chu^*
, I. G. Brown

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

11 Citations (Scopus)

Abstract

The synthesis and properties of niobium nitride films using niobium cathodic arc plasma reactive deposition in a nitrogen atmosphere with and without energetic ion dynamic mixing was discussed. The nitrogen content was higher in the films deposited using energetic ion dynamic mixing at a maximum substrate temperature of 180°centigrate. The films deposited without energetic ion dynamic mixing was found to be smooth and continuous while those with energetic ion dynamic mixing exhibit delamination due to poor adhesion. The results showed that with energetic ion dynamic mixing, niobium nitride films could be fabricated at low substrate temperature using a niobium metal arc plasma source in a nitrogen immersion configuration.

Original language	English
Pages (from-to)	2048-2050
Journal	Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
Volume	19
Issue number	5
DOIs	https://doi.org/10.1116/1.1372896
Publication status	Published - Sept 2001

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@article{cfd9ee4b176142f38cf872d6bb8f532c,

title = "Dynamic mixing deposition of niobium nitride films by cathodic arc plasma in ambient nitrogen",

abstract = "The synthesis and properties of niobium nitride films using niobium cathodic arc plasma reactive deposition in a nitrogen atmosphere with and without energetic ion dynamic mixing was discussed. The nitrogen content was higher in the films deposited using energetic ion dynamic mixing at a maximum substrate temperature of 180°centigrate. The films deposited without energetic ion dynamic mixing was found to be smooth and continuous while those with energetic ion dynamic mixing exhibit delamination due to poor adhesion. The results showed that with energetic ion dynamic mixing, niobium nitride films could be fabricated at low substrate temperature using a niobium metal arc plasma source in a nitrogen immersion configuration.",

author = "T. Zhang and Song, \{J. H.\} and Tian, \{X. B.\} and Chu, \{P. K.\} and Brown, \{I. G.\}",

year = "2001",

month = sep,

doi = "10.1116/1.1372896",

language = "English",

volume = "19",

pages = "2048--2050",

journal = "Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films",

issn = "0734-2101",

publisher = "AVS Science and Technology Society",

number = "5",

}

Dynamic mixing deposition of niobium nitride films by cathodic arc plasma in ambient nitrogen. / Zhang, T.; Song, J. H.; Tian, X. B. et al.
In: Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films, Vol. 19, No. 5, 09.2001, p. 2048-2050.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

TY - JOUR

T1 - Dynamic mixing deposition of niobium nitride films by cathodic arc plasma in ambient nitrogen

AU - Zhang, T.

AU - Song, J. H.

AU - Tian, X. B.

AU - Chu, P. K.

AU - Brown, I. G.

PY - 2001/9

Y1 - 2001/9

N2 - The synthesis and properties of niobium nitride films using niobium cathodic arc plasma reactive deposition in a nitrogen atmosphere with and without energetic ion dynamic mixing was discussed. The nitrogen content was higher in the films deposited using energetic ion dynamic mixing at a maximum substrate temperature of 180°centigrate. The films deposited without energetic ion dynamic mixing was found to be smooth and continuous while those with energetic ion dynamic mixing exhibit delamination due to poor adhesion. The results showed that with energetic ion dynamic mixing, niobium nitride films could be fabricated at low substrate temperature using a niobium metal arc plasma source in a nitrogen immersion configuration.

AB - The synthesis and properties of niobium nitride films using niobium cathodic arc plasma reactive deposition in a nitrogen atmosphere with and without energetic ion dynamic mixing was discussed. The nitrogen content was higher in the films deposited using energetic ion dynamic mixing at a maximum substrate temperature of 180°centigrate. The films deposited without energetic ion dynamic mixing was found to be smooth and continuous while those with energetic ion dynamic mixing exhibit delamination due to poor adhesion. The results showed that with energetic ion dynamic mixing, niobium nitride films could be fabricated at low substrate temperature using a niobium metal arc plasma source in a nitrogen immersion configuration.

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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0035440004&origin=recordpage

U2 - 10.1116/1.1372896

DO - 10.1116/1.1372896

M3 - RGC 21 - Publication in refereed journal

SN - 0734-2101

VL - 19

SP - 2048

EP - 2050

JO - Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

JF - Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

IS - 5

ER -

Dynamic mixing deposition of niobium nitride films by cathodic arc plasma in ambient nitrogen

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