Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration

King-Ning Tu

doi:10.1007/978-0-387-38892-2_11

Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › Chapter in research book/monograph/textbook (Author) › peer-review

Abstract

Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature. © 2007 Springer Science+Business Media, LLC

Original language	English
Title of host publication	Solder Joint Technology
Subtitle of host publication	Materials, Properties, and Reliability
Place of Publication	New York, NY
Publisher	Springer
Pages	305-326
ISBN (Electronic)	978-0-387-38892-2
ISBN (Print)	978-0-387-38890-8, 978-1-4419-2284-7
DOIs	https://doi.org/10.1007/978-0-387-38892-2_11
Publication status	Published - 2007
Externally published	Yes

Publication series

Name	Springer Series in Materials Science
Volume	117
ISSN (Print)	0933-033X
ISSN (Electronic)	2196-2812

Research Keywords

Charpy Impact Test
Drop Test
Solder Ball
Solder Bump
Solder Joint

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keywords = "Charpy Impact Test, Drop Test, Solder Ball, Solder Bump, Solder Joint",

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Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration. / Tu, King-Ning.
Solder Joint Technology: Materials, Properties, and Reliability. New York, NY: Springer , 2007. p. 305-326 (Springer Series in Materials Science; Vol. 117).

Research output: Chapters, Conference Papers, Creative and Literary Works › Chapter in research book/monograph/textbook (Author) › peer-review

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T1 - Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration

AU - Tu, King-Ning

PY - 2007

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AB - Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature. © 2007 Springer Science+Business Media, LLC

KW - Charpy Impact Test

KW - Drop Test

KW - Solder Ball

KW - Solder Bump

KW - Solder Joint

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SN - 978-1-4419-2284-7

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PB - Springer

CY - New York, NY

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Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration

Abstract

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Research Keywords

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