Abstract
Sn-9Zn and Sn-8Zn-3Bi solder balls were bonded to Cu or electroless Au/Ni(P) pads, and the effect of aging on impact reliability was investigated. A test similar to the classic Charpy impact test was performed to measure the impact toughness of the solder joints. In the case of the solder/Cu joints, γ-Cu5Zn88 at the bond interface thickened remarkably with the aging time, accompanied by void formation, resulting in a ductile-to-brittle transition of the joint. In the case of the solder/Au/Ni(P) joints, however, the slow dissolution and diffusion of Ni into the solders as well as the redeposition of Zn at the interface contributed to maintaining high impact toughness even after a prolonged aging. All of the bumps on the Au/Ni(P) broke in a ductile manner. © 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 641-645 |
| Journal | Scripta Materialia |
| Volume | 51 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - Oct 2004 |
| Externally published | Yes |
Bibliographical note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].Research Keywords
- Au-Zn intermetallic compound
- Cu-Zn intermetallic compound
- Ductile-to-brittle transition
- Impact test
- Sn-Zn solder
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