Abstract
Graphene oxide (GO) has emerged as a promising reinforcement material for metal matrix composites due to its exceptional properties. However, achieving homogeneous graphene dispersion within the metal matrix remains a critical challenge that significantly impacts the performance of the composite. In this study, we developed an innovative dual-dispersion medium approach to fabricate Cu@Ag/GO composites. The Cu@Ag particles and GO sheets were dispersed in ethanol in deionized water separately, followed by ultrasonic-assisted mixing and hot-press sintering to create a three-dimensional GO network structure. Experimental results indicate that the dual-dispersion method is conducive to the uniform attachment of GO to the silver-coated copper surface through hydrogen bonding, thereby reducing structural defects and effective effectively inhibiting Ag dewetting. The optimized composite containing 0.2 wt% GO exhibited significantly enhanced sintering properties compared to Cu@Ag: a shear strength of 94.3 MPa (50.2 % improvement), thermal conductivity of 240.0 W/(m·K) (60.5 % improvement), and reduced electrical resistivity of 4.7 μΩ cm (38.8 % decrease). This facile fabrication method of Cu@Ag/GO composites offers significant potential for developing high-performance die-attach and interconnect materials with superior mechanical strength, thermal transfer, and electrical conductivity for advanced power module applications. © 2025 Elsevier Ltd.
| Original language | English |
|---|---|
| Article number | 113130 |
| Number of pages | 17 |
| Journal | Composites Part B: Engineering |
| Volume | 310 |
| Online published | 23 Oct 2025 |
| DOIs | |
| Publication status | Published - 28 Jan 2026 |
Funding
We acknowledge the support of the National Natural Science Foundation of China (Nos. 62204063 and 62174039), the Guangdong S&T Programme (No. 2023B0101020003, 2024B0101120004), and the Science and Technology Program of Guangzhou (No. 2025A04J5209).
Research Keywords
- 3D graphene network
- Ag dewetting suppression
- Cu@Ag/GO composite
- Die-attach materials
- Thermal/electrical conductivity
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