Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

Huayu Sun; Y. C. Chan

doi:10.1109/ESTC.2014.6962816

Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

1 Citation (Scopus)

Abstract

In this study, 0.5 wt.% CNTs-doped solder paste, that prepared by mechanical stirring, was used to detect the redistribution phenomenon of nanoparticles in the solder ball. Some of nanoparticles seriously separated out with the outward flow of solder flux, making related quantitative experiments loss their accuracy. Some of nanoparticles seriously gathered in the solder ball, having negative effects on the solder joint and making the phenomenon of degradation of reinforcement become serious. To study the degradation phenomenon of nanoparticle reinforced solder joint, mechanical properties of Sn58Bi, Sn57.6Bi0.4Ag and doped Sn58Bi+0.4Ag were compared during aging. According to the result of ball shear test, the degradation of reinforcement was seriously happened in the doped Sn58Bi+0.4Ag solder joints. Caused by the gathered Ag₃Sn IMCs, the doped Sn58Bi+0.4Ag solder joints lost its mechanical advantages after 100h aging, comparing with Sn58Bi and Sn57.6Bi0.4Ag solder joints.

Original language	English
Title of host publication	Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
Publisher	IEEE
ISBN (Print)	9781479940264
DOIs	https://doi.org/10.1109/ESTC.2014.6962816
Publication status	Published - 18 Nov 2014
Event	5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki, Finland Duration: 16 Sept 2014 → 18 Sept 2014

Conference

Conference	5th Electronics System-Integration Technology Conference, ESTC 2014
Place	Finland
City	Helsinki
Period	16/09/14 → 18/09/14

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@inproceedings{aa986c3b73264ec19a362502f28badb8,

title = "Drawbacks of the nanoparticle reinforced lead-free BGA solder joints",

abstract = "In this study, 0.5 wt.% CNTs-doped solder paste, that prepared by mechanical stirring, was used to detect the redistribution phenomenon of nanoparticles in the solder ball. Some of nanoparticles seriously separated out with the outward flow of solder flux, making related quantitative experiments loss their accuracy. Some of nanoparticles seriously gathered in the solder ball, having negative effects on the solder joint and making the phenomenon of degradation of reinforcement become serious. To study the degradation phenomenon of nanoparticle reinforced solder joint, mechanical properties of Sn58Bi, Sn57.6Bi0.4Ag and doped Sn58Bi+0.4Ag were compared during aging. According to the result of ball shear test, the degradation of reinforcement was seriously happened in the doped Sn58Bi+0.4Ag solder joints. Caused by the gathered Ag3Sn IMCs, the doped Sn58Bi+0.4Ag solder joints lost its mechanical advantages after 100h aging, comparing with Sn58Bi and Sn57.6Bi0.4Ag solder joints.",

author = "Huayu Sun and Chan, {Y. C.}",

year = "2014",

month = nov,

day = "18",

doi = "10.1109/ESTC.2014.6962816",

language = "English",

isbn = "9781479940264",

booktitle = "Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014",

publisher = "IEEE",

address = "United States",

note = "5th Electronics System-Integration Technology Conference, ESTC 2014 ; Conference date: 16-09-2014 Through 18-09-2014",

}

TY - GEN

T1 - Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

AU - Sun, Huayu

AU - Chan, Y. C.

PY - 2014/11/18

Y1 - 2014/11/18

N2 - In this study, 0.5 wt.% CNTs-doped solder paste, that prepared by mechanical stirring, was used to detect the redistribution phenomenon of nanoparticles in the solder ball. Some of nanoparticles seriously separated out with the outward flow of solder flux, making related quantitative experiments loss their accuracy. Some of nanoparticles seriously gathered in the solder ball, having negative effects on the solder joint and making the phenomenon of degradation of reinforcement become serious. To study the degradation phenomenon of nanoparticle reinforced solder joint, mechanical properties of Sn58Bi, Sn57.6Bi0.4Ag and doped Sn58Bi+0.4Ag were compared during aging. According to the result of ball shear test, the degradation of reinforcement was seriously happened in the doped Sn58Bi+0.4Ag solder joints. Caused by the gathered Ag3Sn IMCs, the doped Sn58Bi+0.4Ag solder joints lost its mechanical advantages after 100h aging, comparing with Sn58Bi and Sn57.6Bi0.4Ag solder joints.

AB - In this study, 0.5 wt.% CNTs-doped solder paste, that prepared by mechanical stirring, was used to detect the redistribution phenomenon of nanoparticles in the solder ball. Some of nanoparticles seriously separated out with the outward flow of solder flux, making related quantitative experiments loss their accuracy. Some of nanoparticles seriously gathered in the solder ball, having negative effects on the solder joint and making the phenomenon of degradation of reinforcement become serious. To study the degradation phenomenon of nanoparticle reinforced solder joint, mechanical properties of Sn58Bi, Sn57.6Bi0.4Ag and doped Sn58Bi+0.4Ag were compared during aging. According to the result of ball shear test, the degradation of reinforcement was seriously happened in the doped Sn58Bi+0.4Ag solder joints. Caused by the gathered Ag3Sn IMCs, the doped Sn58Bi+0.4Ag solder joints lost its mechanical advantages after 100h aging, comparing with Sn58Bi and Sn57.6Bi0.4Ag solder joints.

UR - http://www.scopus.com/inward/record.url?scp=84918581923&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84918581923&origin=recordpage

U2 - 10.1109/ESTC.2014.6962816

DO - 10.1109/ESTC.2014.6962816

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781479940264

BT - Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014

PB - IEEE

T2 - 5th Electronics System-Integration Technology Conference, ESTC 2014

Y2 - 16 September 2014 through 18 September 2014

ER -

Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

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