Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient

Y.Y. Qiao; N. Zhao; C.Y. Liu; C.M.L. Wu; Y.P. Wang; H.T. Ma

doi:10.1016/j.mtcomm.2020.100928

Dramatic morphological reservation of prism-type Cu₆Sn₅ formed on single crystal Cu substrates under temperature gradient

Y.Y. Qiao
, N. Zhao^*
, C.Y. Liu
, C.M.L. Wu
, Y.P. Wang
, H.T. Ma

^*Corresponding author for this work

Department of Materials Science and Engineering

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

17 Citations (Scopus)

Abstract

The morphology evolution of Cu₆Sn₅ grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu₆Sn₅ grains formed on (001)Cu substrate, while a mixture of stubby prism-type and scallop-type Cu₆Sn₅ grains formed on (011)Cu substrate. The prism-type morphology gradually transferred into scallop-type after isothermally reflowed at 270 °C for 10 min. However, with a temperature gradient, the initial perpendicular small prismatic Cu₆Sn₅ grains on (001)Cu substrate and mixed-type Cu₆Sn₅ grains on (011)Cu continued to grow into large prism-type. All the prism-type Cu₆Sn₅ grains grew along same direction after long time reflow under temperature gradient due to the merging of adjacent Cu₆Sn₅ grain pair.

Original language	English
Article number	100928
Journal	Materials Today Communications
Volume	23
Online published	14 Jan 2020
DOIs	https://doi.org/10.1016/j.mtcomm.2020.100928
Publication status	Published - Jun 2020

Research Keywords

3D packaging
Electronic materials
Intermetallic alloys and compounds
Prism-type
Single crystal
Temperature gradient

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@article{0ec32debd86142659a872a71fb170bf2,

title = "Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient",

abstract = "The morphology evolution of Cu6Sn5 grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu6Sn5 grains formed on (001)Cu substrate, while a mixture of stubby prism-type and scallop-type Cu6Sn5 grains formed on (011)Cu substrate. The prism-type morphology gradually transferred into scallop-type after isothermally reflowed at 270 °C for 10 min. However, with a temperature gradient, the initial perpendicular small prismatic Cu6Sn5 grains on (001)Cu substrate and mixed-type Cu6Sn5 grains on (011)Cu continued to grow into large prism-type. All the prism-type Cu6Sn5 grains grew along same direction after long time reflow under temperature gradient due to the merging of adjacent Cu6Sn5 grain pair.",

keywords = "3D packaging, Electronic materials, Intermetallic alloys and compounds, Prism-type, Single crystal, Temperature gradient",

author = "Y.Y. Qiao and N. Zhao and C.Y. Liu and C.M.L. Wu and Y.P. Wang and H.T. Ma",

year = "2020",

month = jun,

doi = "10.1016/j.mtcomm.2020.100928",

language = "English",

volume = "23",

journal = "Materials Today Communications",

issn = "2352-4928",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient

AU - Qiao, Y.Y.

AU - Zhao, N.

AU - Liu, C.Y.

AU - Wu, C.M.L.

AU - Wang, Y.P.

AU - Ma, H.T.

PY - 2020/6

Y1 - 2020/6

N2 - The morphology evolution of Cu6Sn5 grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu6Sn5 grains formed on (001)Cu substrate, while a mixture of stubby prism-type and scallop-type Cu6Sn5 grains formed on (011)Cu substrate. The prism-type morphology gradually transferred into scallop-type after isothermally reflowed at 270 °C for 10 min. However, with a temperature gradient, the initial perpendicular small prismatic Cu6Sn5 grains on (001)Cu substrate and mixed-type Cu6Sn5 grains on (011)Cu continued to grow into large prism-type. All the prism-type Cu6Sn5 grains grew along same direction after long time reflow under temperature gradient due to the merging of adjacent Cu6Sn5 grain pair.

AB - The morphology evolution of Cu6Sn5 grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu6Sn5 grains formed on (001)Cu substrate, while a mixture of stubby prism-type and scallop-type Cu6Sn5 grains formed on (011)Cu substrate. The prism-type morphology gradually transferred into scallop-type after isothermally reflowed at 270 °C for 10 min. However, with a temperature gradient, the initial perpendicular small prismatic Cu6Sn5 grains on (001)Cu substrate and mixed-type Cu6Sn5 grains on (011)Cu continued to grow into large prism-type. All the prism-type Cu6Sn5 grains grew along same direction after long time reflow under temperature gradient due to the merging of adjacent Cu6Sn5 grain pair.

KW - 3D packaging

KW - Electronic materials

KW - Intermetallic alloys and compounds

KW - Prism-type

KW - Single crystal

KW - Temperature gradient

UR - https://www.scopus.com/pages/publications/85078509844

UR - https://www.scopus.com/pages/publications/85078509844#tab=impact

U2 - 10.1016/j.mtcomm.2020.100928

DO - 10.1016/j.mtcomm.2020.100928

M3 - RGC 21 - Publication in refereed journal

SN - 2352-4928

VL - 23

JO - Materials Today Communications

JF - Materials Today Communications

M1 - 100928

ER -