Discharge and Deposition Characteristics of High-Power Impulse Magnetron Sputtering Using Various Target Materials

Bocong Zheng; Zhongzhen Wu; Suihan Cui; Shu Xiao; Liangliang Liu; Hai Lin; Ricky K. Y. Fu; Xiubo Tian; Feng Pan; Paul K. Chu

doi:10.1109/TPS.2018.2884475

Author(s)

Bocong Zheng
Zhongzhen Wu
Suihan Cui
Shu Xiao
Liangliang Liu
Hai Lin
Ricky K. Y. Fu
Xiubo Tian
Feng Pan

Detail(s)

Original language	English
Pages (from-to)	193-198
Journal / Publication	IEEE Transactions on Plasma Science
Volume	47
Issue number	1
Online published	13 Dec 2018
Publication status	Published - Jan 2019

Link(s)

DOI	DOI https://doi.org/10.1109/TPS.2018.2884475 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-85058673826&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(e6c09652-21fd-46ec-ab50-6f9720a7fc5c).html

Abstract

The discharge and deposition characteristics of high-power impulse magnetron sputtering using various target materials with different sputtering yields (Cu, Cr, Ti, and C) were analyzed by a plasma global model. The experimental discharge voltages and currents of various target materials were used as the input parameters of the model. The analysis reveals that the ionization fraction of the sputtered species decreases as increasing the sputtering yield, due to the electron temperature was reduced through the cooling effect of sputtered species. However, as the sputtering yield increases, the plasma density under a given discharge power density is increased and the self-sputtering runaway can be fully developed, resulting in a higher fraction of ion density in the form of metal ions in the ion deposition flux. For some high-sputtering yield materials, such as Cu and Cr, this fraction can be up to 95%.

Research Area(s)

Carbon, chromium, copper, modeling, plasmas, sputtering, titanium.

Citation Format(s)

[ RIS ] [ BibTeX ]

Discharge and Deposition Characteristics of High-Power Impulse Magnetron Sputtering Using Various Target Materials. / Zheng, Bocong; Wu, Zhongzhen; Cui, Suihan; Xiao, Shu; Liu, Liangliang; Lin, Hai; Fu, Ricky K. Y.; Tian, Xiubo; Pan, Feng; Chu, Paul K.

In: IEEE Transactions on Plasma Science, Vol. 47, No. 1, 01.2019, p. 193-198.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

Zheng, B, Wu, Z, Cui, S, Xiao, S, Liu, L, Lin, H, Fu, RKY, Tian, X, Pan, F & Chu, PK 2019, 'Discharge and Deposition Characteristics of High-Power Impulse Magnetron Sputtering Using Various Target Materials', IEEE Transactions on Plasma Science, vol. 47, no. 1, pp. 193-198. https://doi.org/10.1109/TPS.2018.2884475

Zheng, B., Wu, Z., Cui, S., Xiao, S., Liu, L., Lin, H., Fu, R. K. Y., Tian, X., Pan, F., & Chu, P. K. (2019). Discharge and Deposition Characteristics of High-Power Impulse Magnetron Sputtering Using Various Target Materials. IEEE Transactions on Plasma Science, 47(1), 193-198. https://doi.org/10.1109/TPS.2018.2884475

Zheng B, Wu Z, Cui S, Xiao S, Liu L, Lin H et al. Discharge and Deposition Characteristics of High-Power Impulse Magnetron Sputtering Using Various Target Materials. IEEE Transactions on Plasma Science. 2019 Jan;47(1):193-198. https://doi.org/10.1109/TPS.2018.2884475

Zheng, Bocong ; Wu, Zhongzhen ; Cui, Suihan ; Xiao, Shu ; Liu, Liangliang ; Lin, Hai ; Fu, Ricky K. Y. ; Tian, Xiubo ; Pan, Feng ; Chu, Paul K. / Discharge and Deposition Characteristics of High-Power Impulse Magnetron Sputtering Using Various Target Materials. In: IEEE Transactions on Plasma Science. 2019 ; Vol. 47, No. 1. pp. 193-198.