Direct measurement of tensile mechanical properties of few-layer hexagonal boron nitride (h-BN)
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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Original language | English |
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Article number | 224301 |
Journal / Publication | Journal of Applied Physics |
Volume | 135 |
Issue number | 22 |
Online published | 10 Jun 2024 |
Publication status | Published - 14 Jun 2024 |
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Link to Scopus | https://www.scopus.com/record/display.uri?eid=2-s2.0-85196032471&origin=recordpage |
Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(7f3a041e-49e3-4205-94fd-8735b0f6f874).html |
Abstract
Hexagonal boron nitride (h-BN) has excellent thermal conductivity and dielectric properties, which shows great potential for low-dimensional devices. However, mechanical properties of h-BN have not been comprehensively investigated through experiments. In this work, we conduct in situ direct tensile tests on freestanding single-crystal few-layer h-BN nanosheets with various layer numbers from 3 to 8, with an elaborate sample transfer and characterization protocol. Young's modulus of 573.8 ± 101.4 GPa and a tensile fracture strain up to 3.2% are revealed, which are comparable to its monolayer counterpart. Moreover, we find a tough-to-brittle transition in few-layer h-BN with the increase in layer number, which is attributed the interplay between the van der Waals interaction and in-plane covalent bonding. These findings could open up new possibilities in mechanical research of van der Waals materials and provide guidance for the design of h-BN-based devices and composites. © 2024 Author(s).
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Citation Format(s)
Direct measurement of tensile mechanical properties of few-layer hexagonal boron nitride (h-BN). / Zhou, Jingzhuo; Zhu, Mengya; Han, Ying et al.
In: Journal of Applied Physics, Vol. 135, No. 22, 224301, 14.06.2024.
In: Journal of Applied Physics, Vol. 135, No. 22, 224301, 14.06.2024.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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