Abstract
Reliability of microelectronic devices obtained, for example, by flip-chip technology depends on behaviour of solder bumps, under-bump metallization (UBM) and metallic interconnects. Mean time to failure (MTF) of these devices is determined by the processes of intermetallic-phase nucleation, growth, ripening in UBM as well as by nucleation, growth, migration, trapping, interactions of voids in solder bumps and interconnects. A given paper includes recent results of authors, which are concerning: 1) the synergy of diffusion, grain growth and ripening in reaction between copper and liquid solder; 2) the synergy of mass transfer and morphology evolution in two-phase solder bump under sharp temperature gradients; 3) the phenomenological and Monte Carlo models of recently-discovered new mechanism of failure by migration of nano-voids along interfaces; 4) the electromigration-induced grain rotation.
| Original language | English |
|---|---|
| Pages (from-to) | 1-22 |
| Journal | Metallofizika i Noveishie Tekhnologii |
| Volume | 31 |
| Issue number | 1 |
| Publication status | Published - Jan 2009 |
| Externally published | Yes |
Bibliographical note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].Fingerprint
Dive into the research topics of 'Diffusion-driven evolution of morphology in metallic joints and solder balls at electromigration, Thermomi-gration and Reflow'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver