Abstract
While TaOx, HfOx, ZrOx, Hf-doped TaO x, and Zr-doped TaOx thin films are promising high-k gate dielectric candidates, their intrinsic reliability has not yet been investigated. In this paper, the authors examine some fundamental reliability aspects of these high-k films through ramp voltage stress testing. By studying dielectric relaxation and analyzing the transient conductivity, the breakdown mode of the tested high-k film is identified; a sensitive method of breakdown detection in ramped voltage tests is proposed and investigated.
| Original language | English |
|---|---|
| Pages (from-to) | 488-493 |
| Journal | IEEE Transactions on Device and Materials Reliability |
| Volume | 4 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - Sept 2004 |
| Externally published | Yes |
Research Keywords
- Dielectric relaxation
- High-k dielectric
- Thin film breakdown
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