Dielectric properties of polyimide-mica hybrid films

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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Author(s)

  • Yi-He Zhang
  • Zhi-Min Dang
  • John H. Xin
  • Jun-Hui Ji
  • Yuyang Liu
  • Bin Fei
  • Yuanqing Li
  • Juntao Wu
  • Shiyong Yang
  • Lai-Feng Li

Detail(s)

Original languageEnglish
Pages (from-to)1473-1477
Journal / PublicationMacromolecular Rapid Communications
Volume26
Issue number18
Publication statusPublished - 23 Sep 2005
Externally publishedYes

Abstract

Polyimide-mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N-dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical break-down strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI-mica hybrid films decreases with the increase of the mica content at temperatures from -150 to 150°C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI-mica hybrid films could meet the requirements of cryogenic insulating materials. © 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Research Area(s)

  • Dielectric properties, Hybrid film, Polyimide-mica, Structure

Citation Format(s)

Dielectric properties of polyimide-mica hybrid films. / Zhang, Yi-He; Dang, Zhi-Min; Xin, John H.; Daoud, Walid A.; Ji, Jun-Hui; Liu, Yuyang; Fei, Bin; Li, Yuanqing; Wu, Juntao; Yang, Shiyong; Li, Lai-Feng.

In: Macromolecular Rapid Communications, Vol. 26, No. 18, 23.09.2005, p. 1473-1477.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal