Abstract
The reliability and integrity of HfO 2 prepared by direct sputtering of hafnium were studied. By monitoring the current-voltage and current-stressing duration characteristics, we found a significant charge trapping effect in thin film with very short stressing time (<30 s) but the
stress-induced trap generation is insignificant. The breakdown characteristics of hafnium gate oxide were also investigated in detail. We
found that several soft breakdowns take place before a hard breakdown. Area and stress-voltage effects of the time-dependent dielectric
breakdown were observed. Results suggest that the soft and hard breakdowns should have different precursor defects. A two-layer breakdown
model of is proposed to explain these observations.
| Original language | English |
|---|---|
| Pages (from-to) | 29-33 |
| Journal | Microelectronics Journal |
| Volume | 36 |
| Issue number | 1 |
| Online published | 10 Dec 2004 |
| DOIs | |
| Publication status | Published - Jan 2005 |
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