Dewetting of molten Sn on Au/Cu/Cr thin-film metallization

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Detail(s)

Original languageEnglish
Pages (from-to)4014-4016
Journal / PublicationApplied Physics Letters
Volume69
Issue number26
Publication statusPublished - 23 Dec 1996
Externally publishedYes

Abstract

On Au/Cu/Cr thin film surface, a drop of molten Sn first spreads out to wet the surface, but it then pulls back to dewet. The latter is due to the spalling of Cu-Sn compounds and exposing the Cr surface to the molten Sn when all of the Cu film has been consumed by the wetting reaction. Dewetting is clearly undesirable for solder joints in electronic packaging; the phenomenon is presented here. © 1996 American Institute of Physics.

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Citation Format(s)

Dewetting of molten Sn on Au/Cu/Cr thin-film metallization. / Liu, C. Y.; Kim, H. K.; Tu, K. N. et al.

In: Applied Physics Letters, Vol. 69, No. 26, 23.12.1996, p. 4014-4016.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review