Dewetting of molten Sn on Au/Cu/Cr thin-film metallization

C. Y. Liu; H. K. Kim; K. N. Tu; P. A. Totta

doi:10.1063/1.117855

Dewetting of molten Sn on Au/Cu/Cr thin-film metallization

C. Y. Liu
, H. K. Kim
, K. N. Tu
, P. A. Totta

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

49 Citations (Scopus)

Abstract

On Au/Cu/Cr thin film surface, a drop of molten Sn first spreads out to wet the surface, but it then pulls back to dewet. The latter is due to the spalling of Cu-Sn compounds and exposing the Cr surface to the molten Sn when all of the Cu film has been consumed by the wetting reaction. Dewetting is clearly undesirable for solder joints in electronic packaging; the phenomenon is presented here. © 1996 American Institute of Physics.

Original language	English
Pages (from-to)	4014-4016
Journal	Applied Physics Letters
Volume	69
Issue number	26
DOIs	https://doi.org/10.1063/1.117855
Publication status	Published - 23 Dec 1996
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Dewetting of molten Sn on Au/Cu/Cr thin-film metallization",

abstract = "On Au/Cu/Cr thin film surface, a drop of molten Sn first spreads out to wet the surface, but it then pulls back to dewet. The latter is due to the spalling of Cu-Sn compounds and exposing the Cr surface to the molten Sn when all of the Cu film has been consumed by the wetting reaction. Dewetting is clearly undesirable for solder joints in electronic packaging; the phenomenon is presented here. {\textcopyright} 1996 American Institute of Physics.",

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AU - Liu, C. Y.

AU - Kim, H. K.

AU - Tu, K. N.

AU - Totta, P. A.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 1996/12/23

Y1 - 1996/12/23

N2 - On Au/Cu/Cr thin film surface, a drop of molten Sn first spreads out to wet the surface, but it then pulls back to dewet. The latter is due to the spalling of Cu-Sn compounds and exposing the Cr surface to the molten Sn when all of the Cu film has been consumed by the wetting reaction. Dewetting is clearly undesirable for solder joints in electronic packaging; the phenomenon is presented here. © 1996 American Institute of Physics.

AB - On Au/Cu/Cr thin film surface, a drop of molten Sn first spreads out to wet the surface, but it then pulls back to dewet. The latter is due to the spalling of Cu-Sn compounds and exposing the Cr surface to the molten Sn when all of the Cu film has been consumed by the wetting reaction. Dewetting is clearly undesirable for solder joints in electronic packaging; the phenomenon is presented here. © 1996 American Institute of Physics.

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U2 - 10.1063/1.117855

DO - 10.1063/1.117855

M3 - RGC 21 - Publication in refereed journal

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VL - 69

SP - 4014

EP - 4016

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 26

ER -

Dewetting of molten Sn on Au/Cu/Cr thin-film metallization

Abstract

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