Design of Substrate-Integrated Dielectric Resonator Antenna With Dielectric Vias

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)5205-5214
Journal / PublicationIEEE Transactions on Antennas and Propagation
Issue number9
Online published24 Feb 2021
Publication statusPublished - Sep 2021


For the first time, dielectric vias were used to design a substrate-integrated dielectric resonator antenna (DRA). The dielectric vias consist of cylindrical holes drilled into the PCB substrate and filled with pre-sintered nanoparticles of barium strontium titanate (BST). The BST nanoparticles were found to have a dielectric constant of 20, with an approximate loss tangent of ~0.05. The dielectric-vias loaded substrate constitutes an effective medium for the DRA design. The dielectric vias are arranged in a concentric manner around a core substrate material region, giving a wideband multi-ring substrate-integrated DRA. It was found that the wideband behavior is due to two different dielectric resonator modes, namely the TEδ11 mode and TEδ31 half-mode. The TEδ31 half-mode is a modified version of the TEδ31- mode of a regular dielectric resonator and is reported here for the first time. The measured and simulated -10-dB impedance bandwidths of the DRA are 33.4% and 35.8%, respectively.

Research Area(s)

  • Dielectric resonator antenna, dielectric vias, substrate-integrated antenna, wideband antenna