Abstract
Microgyroscopes have several potential applications in the aerospace, automotive, defense and bio-medical engineering. The present work provides a detailed account of the design and simulation for a typical high-resolution comb-driven capacitively-sensed microgyroscope fabricated from SOI 40μm thick wafer. The results show that high sensitivity and resolution are possible by the use of a thicker device layer along with a larger sensing area. A thicker device layer not only increases sensitivity and resolution but also ensures higher pull-in voltages and lower pollution of sensing mode. Comparison of lumped mass/stiffness modeling versus finite element modeling, nonlinearity in the output response, electrostatic pull-in characteristics, and scaling characteristics of natural frequencies and pull-in voltages are some aspects that are discussed in detail. © 2004 Elsevier B.V. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 241-256 |
| Journal | Sensors and Actuators, A: Physical |
| Volume | 116 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 15 Oct 2004 |
| Externally published | Yes |
Research Keywords
- Angular-rate sensor
- MEMS
- Microgyroscope
- Micromachined gyroscope
- Rate-gyroscope
- Rotational-rate sensor
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