Design and prototyping of a MEMS-based crackmeter for structural monitoring

M. Ferri; F. Mancarella; J. Yan; J. E Y Lee; A. A. Seshia; J. Zalesky; K. Soga; A. Roncaglia

doi:10.1109/SENSOR.2009.5285501

Design and prototyping of a MEMS-based crackmeter for structural monitoring

M. Ferri
, F. Mancarella
, J. Yan
, J. E Y Lee
, A. A. Seshia
, J. Zalesky
, K. Soga
, A. Roncaglia^*

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

6 Citations (Scopus)

Abstract

Crack measurement is an important technique in structural monitoring, which is presently implemented with macroscopic devices characterized by rather demanding power consumption requirements. Such devices, consequently, are not very well suited for wireless operation, which is particularly interesting for specific applications involving deployment of a number of crackmeters within large-scale ageing infrastructures with possibility of remote, on-demand sensor interrogation. This paper reports about the research work related to the design and prototyping of a novel crackmeter suited for wireless structural monitoring realized with silicon MEMS strain sensors with high resolution, very low power operation and small size. ©2009 IEEE.

Original language	English
Title of host publication	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	315-318
DOIs	https://doi.org/10.1109/SENSOR.2009.5285501
Publication status	Published - 2009
Externally published	Yes
Event	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: 21 Jun 2009 → 25 Jun 2009

Conference

Conference	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Place	United States
City	Denver, CO
Period	21/06/09 → 25/06/09

Research Keywords

Crack monitoring
MEMS
Strain sensors
Wireless

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10.1109/SENSOR.2009.5285501

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@inproceedings{17333f7a29294f3ba7fe869f2e72a9da,

title = "Design and prototyping of a MEMS-based crackmeter for structural monitoring",

abstract = "Crack measurement is an important technique in structural monitoring, which is presently implemented with macroscopic devices characterized by rather demanding power consumption requirements. Such devices, consequently, are not very well suited for wireless operation, which is particularly interesting for specific applications involving deployment of a number of crackmeters within large-scale ageing infrastructures with possibility of remote, on-demand sensor interrogation. This paper reports about the research work related to the design and prototyping of a novel crackmeter suited for wireless structural monitoring realized with silicon MEMS strain sensors with high resolution, very low power operation and small size. {\textcopyright}2009 IEEE.",

keywords = "Crack monitoring, MEMS, Strain sensors, Wireless",

author = "M. Ferri and F. Mancarella and J. Yan and Lee, \{J. E Y\} and Seshia, \{A. A.\} and J. Zalesky and K. Soga and A. Roncaglia",

year = "2009",

doi = "10.1109/SENSOR.2009.5285501",

language = "English",

isbn = "9781424441938",

pages = "315--318",

booktitle = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems",

note = "TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems ; Conference date: 21-06-2009 Through 25-06-2009",

}

Ferri, M, Mancarella, F, Yan, J, Lee, JEY, Seshia, AA, Zalesky, J, Soga, K & Roncaglia, A 2009, Design and prototyping of a MEMS-based crackmeter for structural monitoring. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285501, pp. 315-318, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 21/06/09. https://doi.org/10.1109/SENSOR.2009.5285501

Design and prototyping of a MEMS-based crackmeter for structural monitoring. / Ferri, M.; Mancarella, F.; Yan, J. et al.
TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 315-318 5285501.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Design and prototyping of a MEMS-based crackmeter for structural monitoring

AU - Ferri, M.

AU - Mancarella, F.

AU - Yan, J.

AU - Lee, J. E Y

AU - Seshia, A. A.

AU - Zalesky, J.

AU - Soga, K.

AU - Roncaglia, A.

PY - 2009

Y1 - 2009

N2 - Crack measurement is an important technique in structural monitoring, which is presently implemented with macroscopic devices characterized by rather demanding power consumption requirements. Such devices, consequently, are not very well suited for wireless operation, which is particularly interesting for specific applications involving deployment of a number of crackmeters within large-scale ageing infrastructures with possibility of remote, on-demand sensor interrogation. This paper reports about the research work related to the design and prototyping of a novel crackmeter suited for wireless structural monitoring realized with silicon MEMS strain sensors with high resolution, very low power operation and small size. ©2009 IEEE.

AB - Crack measurement is an important technique in structural monitoring, which is presently implemented with macroscopic devices characterized by rather demanding power consumption requirements. Such devices, consequently, are not very well suited for wireless operation, which is particularly interesting for specific applications involving deployment of a number of crackmeters within large-scale ageing infrastructures with possibility of remote, on-demand sensor interrogation. This paper reports about the research work related to the design and prototyping of a novel crackmeter suited for wireless structural monitoring realized with silicon MEMS strain sensors with high resolution, very low power operation and small size. ©2009 IEEE.

KW - Crack monitoring

KW - MEMS

KW - Strain sensors

KW - Wireless

UR - https://www.scopus.com/pages/publications/71449126200

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-71449126200&origin=recordpage

U2 - 10.1109/SENSOR.2009.5285501

DO - 10.1109/SENSOR.2009.5285501

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781424441938

SP - 315

EP - 318

BT - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

T2 - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Y2 - 21 June 2009 through 25 June 2009

ER -

Design and prototyping of a MEMS-based crackmeter for structural monitoring

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Research Keywords

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