Demagnification and magnification effects in one-step noncontact pattern transfer by direct-current plasma immersion ion implantation

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Ji Luo
  • Dixon Tat Kun Kwok
  • Cheng Xi Wang
  • L. Li

Detail(s)

Original languageEnglish
Article number6940255
Pages (from-to)552-556
Journal / PublicationIEEE Transactions on Plasma Science
Volume43
Issue number2
Publication statusPublished - 1 Feb 2015

Abstract

Complex patterns formed by an array of micrometer spots can be transferred onto a silicon wafer using a one-step noncontact pattern transfer method by dc plasma immersion ion implantation. The transferred images can be demagnified or magnified by placing a metal ring in contact with the metal mask (demagnification) or sample (magnification). Scanning electron microscopy reveals that the center to center distance between the imaged holes can be reduced from 300 to 245 μm, that is, center to center distance in the mask. The 2-D multiple-grid particle-in-cell simulation illustrates that the electric field between the metal mask and sample leads to the demagnification and magnification effects. This one-step and truly noncontact process that has potential applications in transferring pattern onto soft and flexible substrates is applicable to brittle nanostructures that may not survive etching.

Research Area(s)

  • Particle-in-cell (PIC) simulation, pattern transfer, plasma immersion ion implantation (PIII)

Citation Format(s)

Demagnification and magnification effects in one-step noncontact pattern transfer by direct-current plasma immersion ion implantation. / Luo, Ji; Cheng, Samson H. S.; Kwok, Dixon Tat Kun; Wang, Cheng Xi; Li, L.; Chu, Paul K.

In: IEEE Transactions on Plasma Science, Vol. 43, No. 2, 6940255, 01.02.2015, p. 552-556.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review