TY - GEN
T1 - Delamination and buckling induced by compressive strain in metal thin films
AU - Shen, Y. G.
PY - 2005
Y1 - 2005
N2 - The pattern formation during delamination and buckling in sputter-deposited tungsten thin films under large compressive stresses was investigated. The films were analyzed in situ by a cantilever beam technique, and ex situ by atomic force microscopy (AFM) and focused ion beam. Depending on the magnitude of compressive strain in thin films, different types of buckling patterns were observed. For stresses above a critical value, there was a regime of steady growth in which the incipient blister evolves into a regular sinusoidal-like propagation. At higher strains, the sinusoidal-like wrinkles were developed with constant widths and wavelengths. Some of the wrinkles bifurcated to form branches. With further increase in stress the complicated buckling patches were formed with many irregular lobes. These types of pattern formation have been supported by elastic energy calculations.
AB - The pattern formation during delamination and buckling in sputter-deposited tungsten thin films under large compressive stresses was investigated. The films were analyzed in situ by a cantilever beam technique, and ex situ by atomic force microscopy (AFM) and focused ion beam. Depending on the magnitude of compressive strain in thin films, different types of buckling patterns were observed. For stresses above a critical value, there was a regime of steady growth in which the incipient blister evolves into a regular sinusoidal-like propagation. At higher strains, the sinusoidal-like wrinkles were developed with constant widths and wavelengths. Some of the wrinkles bifurcated to form branches. With further increase in stress the complicated buckling patches were formed with many irregular lobes. These types of pattern formation have been supported by elastic energy calculations.
KW - Buckling
KW - Delamination
KW - Metal thin films
KW - Reactive magnetron sputtering
KW - Stress
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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-33644487414&origin=recordpage
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 0878499695
SN - 9780878499694
VL - 490-491
T3 - Materials Science Forum
SP - 655
EP - 660
BT - Residual Stresses VII, ICRS 7
T2 - 7th International Conference on Residual Stresses, ICRS-7
Y2 - 14 June 2004 through 17 June 2004
ER -