Deformation and fracture in micro-tensile tests of freestanding electrodeposited nickel thin films

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

20 Scopus Citations
View graph of relations

Author(s)

  • Y. Yang
  • N. Yao
  • W. O. Soboyejo
  • C. Tarquinio

Detail(s)

Original languageEnglish
Pages (from-to)1062-1065
Journal / PublicationScripta Materialia
Volume58
Issue number12
Publication statusPublished - Jun 2008
Externally publishedYes

Abstract

In situ scanning electron microscopy micro-tensile tests were conducted on freestanding LIGA nickel thin films of two thicknesses (70 and 270 μm). The deformation and fracture mechanisms were elucidated by in situ scanning electron microscopy imaging and ex situ fractographic analysis. Due to the film microstructural gradient, an apparent thickness effect on the film yield strengths was observed, which was then rationalized with a continuum micromechanics model. © 2008 Acta Materialia Inc.

Research Area(s)

  • LIGA, Micromechanical modeling, Nickel, Tension test, Thin films

Citation Format(s)

Deformation and fracture in micro-tensile tests of freestanding electrodeposited nickel thin films. / Yang, Y.; Yao, N.; Soboyejo, W. O. et al.
In: Scripta Materialia, Vol. 58, No. 12, 06.2008, p. 1062-1065.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review