Abstract
As the aggressive scaling of the metal-oxide-semiconductor structure continues, new reliability challenges in gate dielectric materials now came across as the gate dielectric thickness will be further down scaled to its technological constraint (•, ≡Si-O-O•, ≡Si2N•), diamagnetic defects (≡Si-Si≡, =N-H), dicoordinated Si center (=Si:) and neutral defects (≡SiO•, ≡SiOH, ≡Si-O-O-Si≡) are discussed in detail based on both the experimental and simulation results. © 2002 Elsevier Science Ltd. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 597-605 |
| Journal | Microelectronics Reliability |
| Volume | 42 |
| Issue number | 4-5 |
| DOIs | |
| Publication status | Published - Apr 2002 |
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