TY - GEN
T1 - Cylindrical Spoof Surface Plasmon Transmission Line Based on Via Technology
AU - Gao, Si-Ping
AU - Guo, Yong-Xin
PY - 2020
Y1 - 2020
N2 - This paper presents a cylindrical spoof surface plasmon (C-SSP) transmission line (TL) that can be easily processed by conventional via technology. The proposed C-SSP- TL consists of one via barrel, several via pads attached to it and two annular plates at the ends of the via barrel as ground planes. Such a structure is groundless, slow wave and highly transversely- confined, leading to significant footprint miniaturization and electromagnetic compatibility enhancement. Moreover, its rotational symmetry enables its easy mating with common RF connectors without additional bulky transitions. Parametric studies reveal the SSP characteristics of C-SSP unit cell. Simulation results show the effectiveness of the proposed C-SSP- TL, which can be a promising alternative to traditional interconnects in multilayer PCBs and packages. © 2020 IEEE.
AB - This paper presents a cylindrical spoof surface plasmon (C-SSP) transmission line (TL) that can be easily processed by conventional via technology. The proposed C-SSP- TL consists of one via barrel, several via pads attached to it and two annular plates at the ends of the via barrel as ground planes. Such a structure is groundless, slow wave and highly transversely- confined, leading to significant footprint miniaturization and electromagnetic compatibility enhancement. Moreover, its rotational symmetry enables its easy mating with common RF connectors without additional bulky transitions. Parametric studies reveal the SSP characteristics of C-SSP unit cell. Simulation results show the effectiveness of the proposed C-SSP- TL, which can be a promising alternative to traditional interconnects in multilayer PCBs and packages. © 2020 IEEE.
KW - C-SSP-T
KW - Easy transition to SMA
KW - Interconnec
KW - Via processin
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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85095571708&origin=recordpage
U2 - 10.1109/ICCEM47450.2020.9219434
DO - 10.1109/ICCEM47450.2020.9219434
M3 - RGC 32 - Refereed conference paper (with host publication)
T3 - Proceedings of the IEEE International Conference on Computational Electromagnetics, ICCEM
SP - 199
EP - 200
BT - Proceedings of the 2020 IEEE International Conference on Computational Electromagnetics (ICCEM 2020)
PB - IEEE
T2 - 6th IEEE International Conference on Computational Electromagnetics, ICCEM 2020
Y2 - 24 August 2020 through 26 August 2020
ER -