Cryogenic mechanical behaviors of CrMnFeCoNi high-entropy alloy

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

  • Wujing Fu
  • Wei Zheng
  • Yongjiang Huang
  • Fangmin Guo
  • Songshan Jiang
  • Peng Xue
  • Hongbo Fan
  • Zhiliang Ning
  • Jianfei Sun

Detail(s)

Original languageEnglish
Article number139579
Journal / PublicationMaterials Science and Engineering A
Volume789
Online published29 May 2020
Publication statusPublished - 3 Jul 2020
Externally publishedYes

Abstract

The CrMnFeCoNi high-entropy alloy (HEA) exhibits higher yield strength, ultimate strength and ductility at lower temperature. To further clarify the effect of the testing temperature on microstructure evolution, in-situ synchrotron-based high-energy X-ray diffraction tensile tests were carried out from 298 K down to 123 K. The enhanced yield strength of the alloy at cryogenic temperatures can be attributed to the greater lattice distortion prior to plastic deformation. Higher strain hardening rate leads to the simultaneously enhanced strength and ductility of the studied HEA below room temperature. Both dynamic Hall-Petch hardening (twinning) and dislocation hardening provide high work hardening capacity for this alloy during the plastic deformation at cryogenic temperatures. The increased dislocation density and nano-twins at cryogenic temperatures can be attributed to the decrease in the stacking fault energy as the deformation temperature decreases. These studies could provide an in-depth understanding for the strengthening mechanisms of the HEA in different temperature conditions and guide the exploration of HEAs with superb mechanical properties at cryogenic environments.

Research Area(s)

  • Cryogenic temperature, High energy X-ray diffraction, High-entropy alloy, Nano-twins, Stacking faults

Citation Format(s)

Cryogenic mechanical behaviors of CrMnFeCoNi high-entropy alloy. / Fu, Wujing; Zheng, Wei; Huang, Yongjiang et al.
In: Materials Science and Engineering A, Vol. 789, 139579, 03.07.2020.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review