Critical processes and control challenge in semiconductor packaging

Han-Xiong Li

Critical processes and control challenge in semiconductor packaging

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

Back-end semiconductor packaging is an important process to IC industry. Control in packaging meets challenge because it is a multi-discipline approach. In general, packaging control can be classified into motion, fluid and thermal control. In this paper, some critical processes in packaging are briefly introduced and their difficulty for control as well. Focus will be given to vibration control, fluid dispensing control and thermal management.

Original language	English
Title of host publication	Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)
Pages	156-161
Publication status	Published - 2002
Event	Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002) - Dalian, China Duration: 10 Jul 2002 → 12 Jul 2002

Conference

Conference	Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)
Place	China
City	Dalian
Period	10/07/02 → 12/07/02

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title = "Critical processes and control challenge in semiconductor packaging",

abstract = "Back-end semiconductor packaging is an important process to IC industry. Control in packaging meets challenge because it is a multi-discipline approach. In general, packaging control can be classified into motion, fluid and thermal control. In this paper, some critical processes in packaging are briefly introduced and their difficulty for control as well. Focus will be given to vibration control, fluid dispensing control and thermal management.",

author = "Han-Xiong Li",

year = "2002",

language = "English",

isbn = "0958069212",

pages = "156--161",

booktitle = "Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)",

note = "Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002) ; Conference date: 10-07-2002 Through 12-07-2002",

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AB - Back-end semiconductor packaging is an important process to IC industry. Control in packaging meets challenge because it is a multi-discipline approach. In general, packaging control can be classified into motion, fluid and thermal control. In this paper, some critical processes in packaging are briefly introduced and their difficulty for control as well. Focus will be given to vibration control, fluid dispensing control and thermal management.

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M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 0958069212

SN - 9780958069212

SP - 156

EP - 161

BT - Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)

T2 - Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)

Y2 - 10 July 2002 through 12 July 2002

ER -

Critical processes and control challenge in semiconductor packaging

Abstract

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