Creep resistance of tin-based lead-free solder alloys
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 1373-1377 |
| Journal / Publication | Journal of Electronic Materials |
| Volume | 34 |
| Issue number | 11 |
| Publication status | Published - Nov 2005 |
Link(s)
Abstract
This paper reports on the microstructure-creep property relationship of three precipitation-strengthened tin (Sn)-based lead (Pb)-free solder alloys (Sn-0.7Cu, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu) in bulk samples, together with Sn-37Pb as the alloy for comparison at temperatures of 303 K, 348 K, and 393 K. The creep resistance of these three Sn-based Pb-free solders increases, i.e., the steady-state creep rates decrease, with increasing volume fraction of precipitate phases for the Pb-free solder alloys. Their apparent stress exponents (na ∼ 7.3-17), which are all higher than that of pure Sn, attain higher values with increasing volume fraction of precipitate phases at constant temperature, and with decreasing temperature for the same solder alloy.
Research Area(s)
- Creep, Lead (Pb)-free solder, Microstructure, Precipitation
Citation Format(s)
Creep resistance of tin-based lead-free solder alloys. / Huang, M. L.; Wu, C. M L; Wang, L.
In: Journal of Electronic Materials, Vol. 34, No. 11, 11.2005, p. 1373-1377.
In: Journal of Electronic Materials, Vol. 34, No. 11, 11.2005, p. 1373-1377.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
