Creep deformation of fully lamellar TiAl controlled by the viscous glide of interfacial dislocations

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Original languageEnglish
Pages (from-to)821-827
Journal / PublicationIntermetallics
Issue number7
Publication statusPublished - Jul 1999
Externally publishedYes


Creep mechanisms of fully lamellar TiAl with a refined microstructure (γ lamellae: 100-300 nm thick, α2 lamellae: 10-50 nm thick) have been investigated. A nearly linear creep behavior (i.e. the steady-state creep rate is nearly proportional to the applied stress) was observed when the alloy was creep deformed at low applied stresses (<400 MPa) and intermediate temperatures (650-810 °C). Since the operation and multiplication of lattice dislocations within both γ and α2 lamellae are very limited in a low stress level as a result of the refined lamellar microstructure, creep mechanisms based upon glide and/or climb of lattice dislocations become insignificant. Instead, the motion of interfacial dislocation arrays on γ/α2 and γ/γ interfaces (i.e. interface sliding) has found to be a predominant deformation mechanism. According to the observed interfacial substructure caused by interface sliding and the measured activation energy for creep, it is proposed that creep deformation of the refined lamellar TiAl in the intermediate-temperature and low-stress regime is primarily controlled by the viscous glide of interfacial dislocations.

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