Corrosion behaviors of nanocrystalline and conventional polycrystalline copper

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)1019-1022
Journal / PublicationJournal of Materials Science
Volume40
Issue number4
Publication statusPublished - Feb 2005
Externally publishedYes

Abstract

The corrosion behavior of nanocrystalline and polycrystalline copper samples, fabricated by electrodeposition with an electrolyte of CuSO 4, was investigated. The fluctuating current transients and current noise power spectrum on the polycrystalline copper surface indicated the frequent initiation, growth and passivation process of metastable pits. The results showed that the surface of the nanocrystalline copper is more active during initial immersion, leading to the formation of a passive film quickly. The uniform passive film then protects the nanocrystalline copper from the further corrosion.

Citation Format(s)

Corrosion behaviors of nanocrystalline and conventional polycrystalline copper. / Yu, J. K.; Han, E. H.; Lu, L. et al.

In: Journal of Materials Science, Vol. 40, No. 4, 02.2005, p. 1019-1022.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review