Correction : Antibody-coated microstructures for selective isolation of immune cells in blood

Research output: Journal Publications and Reviews › Erratum

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Detail(s)

Original language	English
Pages (from-to)	848
Journal / Publication	Lab on a Chip
Volume	22
Issue number	4
Online published	3 Feb 2022
Publication status	Published - 21 Feb 2022

Link(s)

DOI	DOI https://doi.org/10.1039/d2lc90016e Final Published version
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Attachment(s)	Documents 95647099.pdf Final Published version, 114 KB, PDF Publisher's Copyright Statement This full text is made available under CC-BY 3.0. https://creativecommons.org/licenses/by/3.0/
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-85124636137&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(a2aacf40-f842-4c95-b128-f411b391de9b).html

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[ RIS ] [ BibTeX ]

Correction: Antibody-coated microstructures for selective isolation of immune cells in blood. / Li, Jiyu ; Liu, Ya ; Ren, Jifeng et al.
In: Lab on a Chip, Vol. 22, No. 4, 21.02.2022, p. 848.

Research output: Journal Publications and Reviews › Erratum

Li, J , Liu, Y , Ren, J, Tay, BZ, Luo, T , Fan, L , Sun, D , Luo, G , Lau, D, Marcos, & Lam, RHW 2022, 'Correction: Antibody-coated microstructures for selective isolation of immune cells in blood', Lab on a Chip, vol. 22, no. 4, pp. 848. https://doi.org/10.1039/d2lc90016e

Li, J., Liu, Y., Ren, J., Tay, B. Z., Luo, T., Fan, L., Sun, D., Luo, G., Lau, D., Marcos, & Lam, R. H. W. (2022). Correction: Antibody-coated microstructures for selective isolation of immune cells in blood. Lab on a Chip, 22(4), 848. https://doi.org/10.1039/d2lc90016e

Li J , Liu Y , Ren J, Tay BZ, Luo T , Fan L et al. Correction: Antibody-coated microstructures for selective isolation of immune cells in blood. Lab on a Chip. 2022 Feb 21;22(4):848. Epub 2022 Feb 3. doi: 10.1039/d2lc90016e

Li, Jiyu ; Liu, Ya ; Ren, Jifeng et al. / Correction : Antibody-coated microstructures for selective isolation of immune cells in blood. In: Lab on a Chip. 2022 ; Vol. 22, No. 4. pp. 848.

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