TY - CHAP
T1 - Copper–Tin Reactions in Flip Chip Solder Joints
AU - Tu, King-Ning
PY - 2007
Y1 - 2007
N2 - In Chapters 2 and 3, we discussed solder reactions on bulk and thin-film Cu, respectively. In those reactions, there is only one interface between the solder and the Cu. However, in a solder joint there are two interfaces. Typically a solder joint joins two pieces of Cu tube together as in plumbing, or it joins two metallic contacts as in Si devices. These two interfaces in a fiip chip solder joint are not independent of each other from the point of view of interfacial reactions. © 2007 Springer Science+Business Media, LLC
AB - In Chapters 2 and 3, we discussed solder reactions on bulk and thin-film Cu, respectively. In those reactions, there is only one interface between the solder and the Cu. However, in a solder joint there are two interfaces. Typically a solder joint joins two pieces of Cu tube together as in plumbing, or it joins two metallic contacts as in Si devices. These two interfaces in a fiip chip solder joint are not independent of each other from the point of view of interfacial reactions. © 2007 Springer Science+Business Media, LLC
KW - Composite Solder Joint
KW - Eutectic Solder
KW - Solder Ball
KW - Solder Bump
KW - Solder Joint
UR - https://www.scopus.com/pages/publications/85072868861
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85072868861&origin=recordpage
U2 - 10.1007/978-0-387-38892-2_4
DO - 10.1007/978-0-387-38892-2_4
M3 - Chapter in research book/monograph/textbook (Author)
SN - 978-0-387-38890-8
SN - 978-1-4419-2284-7
T3 - Springer Series in Materials Science
SP - 111
EP - 125
BT - Solder Joint Technology
PB - Springer
CY - New York, NY
ER -