Copper nanoparticles grafted on a silicon wafer and their excellent surface-enhanced Raman scattering

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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Author(s)

  • Qi Shao
  • Ronghui Que
  • Mingwang Shao
  • Liang Cheng
  • Shuit-Tong Lee

Detail(s)

Original languageEnglish
Pages (from-to)2067-2070
Journal / PublicationAdvanced Functional Materials
Volume22
Issue number10
Publication statusPublished - 23 May 2012

Abstract

Copper nanoparticles grafted on a silicon wafer are fabricated by reducing copper ions with silicon-hydrogen bonds and assembling them in situ on the Si wafer. The nanoparticles, with an average size of 20 nm, grow uniformly and densely on the Si wafer, and they are used as substrates for surface-enhanced Raman scattering. These substrates exhibit excellent enhancement in the low concentration detection (1 × 10 -9 M) of rhodamine 6G with an enhancement factor (EF) of 2.29 × 10 7 and a relative standard deviation (RSD) of

Research Area(s)

  • assembly, Cu nanoparticles, Si-H bonds, surface-enhanced Raman scattering (SERS)

Citation Format(s)

Copper nanoparticles grafted on a silicon wafer and their excellent surface-enhanced Raman scattering. / Shao, Qi; Que, Ronghui; Shao, Mingwang; Cheng, Liang; Lee, Shuit-Tong.

In: Advanced Functional Materials, Vol. 22, No. 10, 23.05.2012, p. 2067-2070.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal