CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES

S. Joe Qin; Gregory Cherry; Richard Good; Jin Wang; Christopher A. Harrison

doi:10.1016/S1474-6670(17)31804-9

CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES

S. Joe Qin^*, Gregory Cherry, Richard Good, Jin Wang, Christopher A. Harrison

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

8 Citations (Scopus)

Abstract

The semiconductor industry is going through a technology transition from 200mm to 300mm wafers to improve manufacturing efficiency and reduce manufacturing cost per chip. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context, process and metrology data monitoring are discussed with an example, and missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.

Original language	English
Title of host publication	Dynamics and Control of Process Systems 2004 (DYCOPS -7)
Subtitle of host publication	A Proceedings volume from the 7th IFAC Symposium
Editors	Sirish L. Shah, John MacGregor
Publisher	Elsevier Ltd.
Pages	125-136
Volume	1
ISBN (Print)	0080442978
DOIs	https://doi.org/10.1016/S1474-6670(17)31804-9
Publication status	Published - Jul 2004
Externally published	Yes
Event	7th IFAC Symposium on Dynamics and Control of Process Systems, DYCOPS 2004 - Cambridge, United States Duration: 5 Jul 2004 → 7 Jul 2004

Publication series

Name	IFAC Proceedings Volumes
Number	9
Volume	37
ISSN (Print)	1474-6670

Conference

Conference	7th IFAC Symposium on Dynamics and Control of Process Systems, DYCOPS 2004
Place	United States
City	Cambridge
Period	5/07/04 → 7/07/04

Funding

Financial support from National Science Foundation under CTS-9985074 and a Faculty Research Assignment grant from University of Texas is gratefully acknowledged.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Research Keywords

Electrical parameter control
Fab-wide control
Fault detection and classification
Metrology data monitoring
Run to run control
Semiconductor manufacturing

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10.1016/S1474-6670(17)31804-9

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Joe Qin, S., Cherry, G., Good, R., Wang, J., & Harrison, C. A. (2004). CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES. In S. L. Shah, & J. MacGregor (Eds.), Dynamics and Control of Process Systems 2004 (DYCOPS -7): A Proceedings volume from the 7th IFAC Symposium (Vol. 1, pp. 125-136). (IFAC Proceedings Volumes ; Vol. 37, No. 9). Elsevier Ltd.. https://doi.org/10.1016/S1474-6670(17)31804-9

Joe Qin, S. ; Cherry, Gregory ; Good, Richard et al. / CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES : CHALLENGES AND OPPORTUNITIES. Dynamics and Control of Process Systems 2004 (DYCOPS -7): A Proceedings volume from the 7th IFAC Symposium. editor / Sirish L. Shah ; John MacGregor. Vol. 1 Elsevier Ltd., 2004. pp. 125-136 (IFAC Proceedings Volumes ; 9).

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title = "CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES",

abstract = "The semiconductor industry is going through a technology transition from 200mm to 300mm wafers to improve manufacturing efficiency and reduce manufacturing cost per chip. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context, process and metrology data monitoring are discussed with an example, and missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.",

keywords = "Electrical parameter control, Fab-wide control, Fault detection and classification, Metrology data monitoring, Run to run control, Semiconductor manufacturing",

author = "{Joe Qin}, S. and Gregory Cherry and Richard Good and Jin Wang and Harrison, {Christopher A.}",

year = "2004",

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booktitle = "Dynamics and Control of Process Systems 2004 (DYCOPS -7)",

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Joe Qin, S, Cherry, G, Good, R, Wang, J & Harrison, CA 2004, CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES. in SL Shah & J MacGregor (eds), Dynamics and Control of Process Systems 2004 (DYCOPS -7): A Proceedings volume from the 7th IFAC Symposium. vol. 1, IFAC Proceedings Volumes , no. 9, vol. 37, Elsevier Ltd., pp. 125-136, 7th IFAC Symposium on Dynamics and Control of Process Systems, DYCOPS 2004, Cambridge, United States, 5/07/04. https://doi.org/10.1016/S1474-6670(17)31804-9

CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES. / Joe Qin, S.; Cherry, Gregory; Good, Richard et al.
Dynamics and Control of Process Systems 2004 (DYCOPS -7): A Proceedings volume from the 7th IFAC Symposium. ed. / Sirish L. Shah; John MacGregor. Vol. 1 Elsevier Ltd., 2004. p. 125-136 (IFAC Proceedings Volumes ; Vol. 37, No. 9).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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T1 - CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES

T2 - 7th IFAC Symposium on Dynamics and Control of Process Systems, DYCOPS 2004

AU - Joe Qin, S.

AU - Cherry, Gregory

AU - Good, Richard

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N2 - The semiconductor industry is going through a technology transition from 200mm to 300mm wafers to improve manufacturing efficiency and reduce manufacturing cost per chip. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context, process and metrology data monitoring are discussed with an example, and missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.

AB - The semiconductor industry is going through a technology transition from 200mm to 300mm wafers to improve manufacturing efficiency and reduce manufacturing cost per chip. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context, process and metrology data monitoring are discussed with an example, and missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.

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KW - Fault detection and classification

KW - Metrology data monitoring

KW - Run to run control

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M3 - RGC 32 - Refereed conference paper (with host publication)

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VL - 1

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ER -

Joe Qin S, Cherry G, Good R, Wang J, Harrison CA. CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES. In Shah SL, MacGregor J, editors, Dynamics and Control of Process Systems 2004 (DYCOPS -7): A Proceedings volume from the 7th IFAC Symposium. Vol. 1. Elsevier Ltd. 2004. p. 125-136. (IFAC Proceedings Volumes ; 9). doi: 10.1016/S1474-6670(17)31804-9

CONTROL AND MONITORING OF SEMICONDUCTOR MANUFACTURING PROCESSES: CHALLENGES AND OPPORTUNITIES

Abstract

Publication series

Conference

Funding

UN SDGs

Research Keywords

Access Output

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