Contact-dependent reliability of spin valve heads
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 2602-2604 |
Journal / Publication | IEEE Transactions on Magnetics |
Volume | 36 |
Issue number | 5 |
Online published | Sept 2000 |
Publication status | Published - Sept 2000 |
Externally published | Yes |
Conference
Title | 2000 International Magnetics Conference (INTERMAG 2000) |
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Place | Canada |
City | Toronto, Ont |
Period | 9 - 12 April 2000 |
Link(s)
Abstract
Contact-dependent failure modes were observed in spin valve sensors in nominal current density range of 2 - 5 × 107 A/cm2 at 70°C ambient. At high bias condition, continually decreased quasistatic test (QST) transfer curve amplitude with negligible resistance change was observed in sensors abutted with Ta contact. In contrast, steady resistance rise with relatively unchanged amplitude was seen in Ta/Au/Ta-contact device prior to catastrophic burnout. Void formation is apparent in the Au layer of the burnout device. Locations of the voids show bias polarity dependency, suggesting an electromigration mechanism in the Au layer.
Research Area(s)
- Contact materials, Electrical reliability, Electromigration, Spin valve
Citation Format(s)
Contact-dependent reliability of spin valve heads. / Tsu, I-Fei; Morrone, Augusto; Huang, Rong-Tan et al.
In: IEEE Transactions on Magnetics, Vol. 36, No. 5, 09.2000, p. 2602-2604.
In: IEEE Transactions on Magnetics, Vol. 36, No. 5, 09.2000, p. 2602-2604.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review