Contact-dependent reliability of spin valve heads

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

3 Scopus Citations
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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)2602-2604
Journal / PublicationIEEE Transactions on Magnetics
Volume36
Issue number5
Online publishedSept 2000
Publication statusPublished - Sept 2000
Externally publishedYes

Conference

Title2000 International Magnetics Conference (INTERMAG 2000)
PlaceCanada
CityToronto, Ont
Period9 - 12 April 2000

Abstract

Contact-dependent failure modes were observed in spin valve sensors in nominal current density range of 2 - 5 × 107 A/cm2 at 70°C ambient. At high bias condition, continually decreased quasistatic test (QST) transfer curve amplitude with negligible resistance change was observed in sensors abutted with Ta contact. In contrast, steady resistance rise with relatively unchanged amplitude was seen in Ta/Au/Ta-contact device prior to catastrophic burnout. Void formation is apparent in the Au layer of the burnout device. Locations of the voids show bias polarity dependency, suggesting an electromigration mechanism in the Au layer.

Research Area(s)

  • Contact materials, Electrical reliability, Electromigration, Spin valve

Citation Format(s)

Contact-dependent reliability of spin valve heads. / Tsu, I-Fei; Morrone, Augusto; Huang, Rong-Tan et al.
In: IEEE Transactions on Magnetics, Vol. 36, No. 5, 09.2000, p. 2602-2604.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review