Abstract
We present the use of integrated semiconductor nanocoils for conductometric sensors. The three-dimensional structures are made of an n-type InGaAs/GaAs bilayer. They are suspended over the chip surface and connected to one electrode on each side. The process is based on conventional batch micro fabrication techniques. Process and design features that are critical for the realization of this type of device are described. High sensor performance can be achieved due to the high surface-to-volume ratio of the helical nanostructures. The use of these structures for temperature sensors and for photoconductive detectors is demonstrated.
| Original language | English |
|---|---|
| Title of host publication | 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS) |
| Pages | 847-850 |
| DOIs | |
| Publication status | Published - Jan 2007 |
| Externally published | Yes |
| Event | 20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007) - Kobe, Japan Duration: 21 Jan 2007 → 25 Jan 2007 |
Publication series
| Name | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
|---|---|
| ISSN (Print) | 1084-6999 |
Conference
| Conference | 20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007) |
|---|---|
| Place | Japan |
| City | Kobe |
| Period | 21/01/07 → 25/01/07 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
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