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Conductive nanolamellar Cu/martensite wire with high strength

  • Yadong Ru
  • , Kaiyuan Yu*
  • , Fangmin Guo
  • , Yang Ren
  • , Lishan Cui
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

Cu wires can be significantly strengthened without losing much conductivity if a continuous nanolamellar structure with Cu and a strong second constituent is achieved. We report on a nanolamellar Cu/steel wire fabricated by repetitive hot-pressing, forging, rolling and subsequent wire drawing. Austenization and quenching in liquid nitrogen resulted in a Cu/martensite structure, exhibiting tensile strength of 1220 MPa. The electrical conductivity of the wire was measured to be about 60% International Annealed Copper Standard (IACS), which was comparable with Cu/Fe fabricated by alloying and casting. In situ tensile tests under high energy X-ray diffraction were utilized to explore the deformation behavior of the wire. It was found that the martensite carried about 60% of the load, accounting for the high strength.
Original languageEnglish
Pages (from-to)344-347
JournalMaterials Letters
Volume229
DOIs
Publication statusPublished - 15 Oct 2018
Externally publishedYes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

  • High strength and conductivity
  • In situ synchrotron X-ray diffraction
  • Martensite
  • Multilayer structure
  • Nanocomposites

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