Computational study on the mechanical properties in nanoscale Cu/Sn/Cu Solder joints

Sha XU, Yan Cheong CHAN, Qingqian LI, Shafiq ISMATHULLAKHAN

Research output: Conference Papers › RGC 32 - Refereed conference paper (without host publication) › peer-review

Original language	English
Publication status	Published - 13 Apr 2011
Event	ICEP 2011/ International Conference on Electronic Packaging 2011 - Nara, Japan Duration: 13 Apr 2011 → 15 Apr 2011

Conference	ICEP 2011/ International Conference on Electronic Packaging 2011
Place	Japan
City	Nara
Period	13/04/11 → 15/04/11

Other Access Options

@conference{a89bb2c9e3e841dfa504e5d06ee68db4,

title = "Computational study on the mechanical properties in nanoscale Cu/Sn/Cu Solder joints",

author = "Sha XU and CHAN, {Yan Cheong} and Qingqian LI and Shafiq ISMATHULLAKHAN",

year = "2011",

month = apr,

day = "13",

language = "English",

note = "ICEP 2011/ International Conference on Electronic Packaging 2011 ; Conference date: 13-04-2011 Through 15-04-2011",

}

TY - CONF

T1 - Computational study on the mechanical properties in nanoscale Cu/Sn/Cu Solder joints

AU - XU, Sha

AU - CHAN, Yan Cheong

AU - LI, Qingqian

AU - ISMATHULLAKHAN, Shafiq

PY - 2011/4/13

Y1 - 2011/4/13

M3 - RGC 32 - Refereed conference paper (without host publication)

T2 - ICEP 2011/ International Conference on Electronic Packaging 2011

Y2 - 13 April 2011 through 15 April 2011

ER -