Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Alloying Material Science
100
Tin Material Science
50
Intermetallics Material Science
25
Density Material Science
25
Nanoparticle Material Science
25
Microhardness Material Science
25
Diffusivity Material Science
25
Solder Joint Material Science
25
Shear Strength Material Science
25
Mechanical Testing Material Science
25
Ag Doping Material Science

Chemical Engineering

100
Nanoparticle Chemical Engineering
Research OutputsResearch Output authored by Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods is tagged with the concept