Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)6835-6844
Journal / PublicationJournal of Materials Science: Materials in Electronics
Volume27
Issue number7
Publication statusPublished - 9 Mar 2016

Citation Format(s)

Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods. / Zhu, Ze; Sun, Huayu; Wu, Fengshun; Chan, Yan-cheong.

In: Journal of Materials Science: Materials in Electronics, Vol. 27, No. 7, 09.03.2016, p. 6835-6844.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review