为提高含能微芯片的能量特性和燃烧特性,推进其在微推进器、微驱动器、微毁伤器等装置中的应用,通过在铜箔上原位生长含能配位聚合物 (ECP)、电子束沉积 n-Al 及重结晶 CL-20 的方法制备了ECP@Al@CL-20 的含能阵列, 采用 SEM、XRD、TG/DSC 及高速摄影等表征方法对其微观形貌、物相组成、热分解特性、燃烧性能及贮存寿命进行了测试与分析。在此基础上,将其与微机电系统 (MEMS) 集成制得了功能性的 ECP@Al@CL-20 含能微芯片, 并对含能微芯片进行了电容点火测试。结果表明, 由于 ECP 的导热系数低, 使 ECP@Al@CL-20 含能阵列从外到内的传热效率降低, 导致放热峰温相比纯 CL-20 提高了 8.5 ℃, 从而提高了 ECP@Al@CL-20 的热稳定性; ECP@Al@CL-20含能阵列具有优异的燃烧性能, 自持燃烧时间 (340 ms) 远大于 ECP@A l的自持燃烧时间 (120 ms), 含能微芯片可在15 mJ 的输入能量下激发。

To enhance the energy characteristics and combustion performance of energetic microchips for their application in micro-propulsors, micro-actuators, and micro-detonators, the ECP@AI@ CL-20 energetic array were synthesized through in situ growth of energetic coordination polymer(ECP) on copper foil, e-beam deposition of n-AI, and recrystallization of CL-20. The morphology, phase composition, thermal decomposition, combustion performance, and storage life were characterized by SEM, XRD, TG-DSC and high-speed photography. In addition, the functional ECP@AI@CL-20 energetic microchips were integrated with microelectro mechanical system(MEMS) and subjected to capacitor ignition tests. The results show that the ECP @AI@ CL-20 energetic array reduces heat transfer efficiency from outside to inside due to the low thermal conductivity of ECP, resulting an increase of 8. 5 °C in the exothermic peak temperature compared to pure CL-20, thereby increasing the thermal stability of ECP@AI@CL-20. The ECP@AI@CL-20 energetic array has excellent combustion performance, its self-sustaining combustion time (340 ms) is much higher than that of ECP@AI (120 ms), and it can be ignited under 15 mJ of input energy.